SMD SMD chip crystal oscillator is the most popular quartz crystal oscillator product on the market at present. The 49S crystal oscillator, cylindrical crystal oscillator and ceramic crystal oscillator commonly used in the past are gradually replaced by chip quartz crystal oscillator. The reason why it is loved by manufacturers is that the small packaged SMD crystal oscillator has the characteristics of high precision, high temperature resistance, low load, impact resistance, and more importantly, it meets the requirements of modern high-tech products almost perfectly.
Quartz crystal oscillator is a quartz crystal resonator made of crystal chips and quartz shells, commonly known as crystal oscillator. The higher the crystal chip density is, the better the crystal quality is. The stability of crystal oscillator is the first choice for the quality of quartz crystal oscillator. Today, Matsuji Electronic Quartz Crystal Analyzer: the whole production process of small volume and large production.
- Crystal selection:
Crystals are divided into natural crystals and artificial crystals. The purity of natural crystal is poor and the resources are limited, while the purity of artificial crystal oscillator is high and the resources are rich. Therefore, the production of crystal oscillator now basically uses artificial crystal.
- Chip cutting: The most important component of the quartz crystal oscillator is the crystal oscillator, which is cut by the crystal crystal according to certain rules, also known as the chip.
- Grinding: Grind the surface of the wafer to make its thickness and surface roughness meet the requirements. Generally, the thickness of the actual SMD crystal oscillator wafer is smaller than the theoretical one, because the subsequent evaporation and plating process will evaporate a layer of silver on the wafer surface to increase the wafer thickness. The above can be expressed by the following formula: theoretical thickness=actual thickness+evaporation coating thickness.
- Chamfering
- Etch and wash to remove impurities on the wafer surface.
- Vapor plating A layer of silver is evaporated on the surface of the wafer as the electrode.
- Assemble conductive silver glue, HOLDER, and the contact negative reactance is about 3 Ω.
- The frequency fine adjustment uses a thin silver coating as its electrode, and then adjusts the thickness of the silver coating to change the thickness of the wafer to achieve the function of fine adjustment.
- Complete tests to check various parameters, such as Rr, C0, insulation, air tightness, etc.
Although the passive chip crystal oscillator is small, it has great energy and has already penetrated our daily life. From the above production processes, its production process is very complex!
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